In an inverter apparatus in which a three-phase inverter main circuit having a
plurality of arms comprises a plurality of semiconductor chips for electric power,
one arm of the three-phase inverter main circuit includes IGBTs and diodes of semiconductor
chips having a size of 10 mm by 10 mm or less with the semiconductor chips connected
in parallel, while the IGBTs and the diodes are bonded to a conductor having a
thickness of 1.5 mm or more and 5 mm or less, and the conductor is glued to a cooler
through an insulating resin sheet containing ceramics.
