Embodiments of a conditioning mechanism for a chemical mechanical polishing
system have been provided. In one embodiment, a conditioning mechanism includes
a rotor assembly and a conditioning element mounting assembly. A seal is disposed
between the rotor assembly and conditioning element mounting assembly and bounds
one surface of an expandable plenum defined between the rotor assembly and conditioning
element mounting assembly. A spring is disposed between the rotor and conditioning
element mounting assemblies and is adapted to bias a lower surface of the conditioning
element mounting assembly towards the rotor assembly.
