A method of manufacturing a semiconductor device includes mounting of a semiconductor
chip on a substrate. In the mounting step, electrodes of the semiconductor chip
and leads formed on the substrate are disposed to face each other. Each of the
electrodes has a bump including a soldering or brazing material in at least part
of a bonding section bonded to corresponding one of the leads. After providing
an insulating material around the electrodes and leads, the soldering or brazing
material is melted, and the electrodes are respectively bonded to the leads.
