The invention includes a physical vapor deposition target composed of a face
centered cubic unit cell metal or alloy and having a uniform grain size less than
30 microns, preferably less than 1 micron; and a uniform axial or planar <220
texture. Also described is a method for making sputtering targets. The method can
comprise billet preparation; equal channel angular extrusion with a prescribed
route and number of passes; and cross-rolling or forging subsequent to the equal
channel angular extrusion.
