A thermal support may receive one or more power electronic circuits. The support
may aid in removing heat from the circuits through fluid circulating through the
support. Power electronic circuits are thermally matched, such as between component
layers and between the circuits and the support. The support may form a shield
from both external EMI/RFI and from interference generated by operation of the
power electronic circuits. Features may be provided to permit and enhance connection
of the circuitry to external circuitry, such as improved terminal configurations.
Modular units may be assembled that may be coupled to electronic circuitry via
plug-in arrangements or through interface with a backplane or similar mounting
and interconnecting structures.
