A method for testing an optical chip, while the optical chip is still on a wafer,
utilizing an optical probe, includes the steps of creating an access point on the
wafer adjacent the optical chip. Inserting a probe at the access point to optically
couple the optical probe and optical chip. The optical probe includes at least
a first optical waveguide for changing the direction of input light at the probe
to optically couple with the optical chip at the access point.
