The method of fabricating a nitride semiconductor of this invention includes
the steps of forming, on a substrate, a first nitride semiconductor layer of AluGavInwN,
wherein 0u, v, w1 and u+v+w=1; forming, in an upper portion of
the first nitride semiconductor layer, plural convexes extending at intervals along
a substrate surface direction; forming a mask film for covering bottoms of recesses
formed between the convexes adjacent to each other; and growing, on the first nitride
semiconductor layer, a second nitride semiconductor layer of AlxGayInzN,
wherein 0x, y, z1 and x+y+z=1, by using, as a seed crystal, C planes
corresponding to top faces of the convexes exposed from the mask film.