A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink
adjacent a first device, a second duct, and a second heat sink adjacent a second
device. The gas supply may be realized as a fan, a blower, or a compressed gas
source. The first duct provides a passageway for delivering pressurized gas from
the gas supply to the first heat sink. The duct may include a plurality of vanes
for reducing the turbulence and air boundary separation within the duct. The first
heatsink is in thermal communication with a first heat-producing device such as
a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped
folded fin heatsink. The second duct is used to provide a pathway for the air leaving
the first heatsink and delivers the air to the second heatsink. The second duct
may also include a plurality of vanes for reducing turbulence and boundary flow
separation within the second duct.
