A method for manufacturing and packaging an integrated circuit includes following
steps: pressure a continuous pin material and a base board area at first; then
cut off pin material into several pin units, accommodate each pin units into respective
position in a mould, and ejecting plastic into the mould gap to shape a pin unit,
then remove waste part of the pin material after removing down the mould parts;
put four pin units and a base board into a rectangle mould, then eject plastic
again into mould gap, after that cut off waste part of the base board to attain
an IC socket; stick an IC chip on top of the base board of the IC socket and wire
it. Finally, cover and stick a panel on the IC socket to finish the whole IC packaging procedures.
