A metal plating bath containing organic compounds that inhibit or retard the
consumption
of plating bath additives. The additives are chemical compounds that improve the
brightness of the plated metal, the physical properties of the plated metal especially
with respect to ductility and the micro-throwing power as well as the macro-throwing
power of the plating bath. The organic compounds that inhibit or retard the consumption
of additives increases the life of the plating bath and improves the efficiency
of the plating process. The plating baths containing the organic compounds that
inhibit or retard additive consumption can be employed to copper, gold, silver,
palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium,
and iridium.
