Systems and methods are described for environmental exchange control for
a polymer on a wafer surface. An apparatus for controlling an exchange between
an environment and a polymer on a surface of a wafer located in the environment
includes: a chamber adapted to hold the wafer, define the environment, and maintain
the polymer in an adjacent relationship with the environment; and a heater coupled
to the chamber.
A method for improving performance of a spin-on material includes: forming the
spin-on material on a surface of a wafer; then locating the spin-on material in
an environment so that said environment is adjacent said spin-on material; and
then controlling an exchange between the spin-on material and said environment.
The systems and methods provide advantages because inappropriate deprotection is
mitigated by careful control of the environmental temperature and environmental
species partial pressures (e.g. relative humidity).
