An electronic component module includes a mounting substrate including a shield
layer and on which a first cavity and a second cavity are formed. A first electronic
component positioned in the first cavity is used in a first frequency band. A second
electronic component positioned in the second cavity is used in a second frequency
band. Lid members seal the first cavity and the second cavity. Patch antennas transmit/receive
radio waves in the first and second frequency bands, the antennas being formed
on a surface opposite to the electronic components mounting surface. And, connection
terminals formed on the mounting substrate are electrically connected to the electronic
components through transmission lines.
