Apparatus and methods for applying atomized pulsed streams of flux to a
surface such as a printed circuit board. The flux is applied discretely in selected
locations and at selected thickness based upon pulse rate, fluid pressure, air
pressure and traverse speed. The apparatus consists of a precise orifice with a
surrounding air passage for atomizing and focusing the flux at a discrete location
on the surface. Controls are incorporated for selecting, controlling and monitoring
the flux deposition amount and location, for coordinating with the transport motion
system, for integrating with the adjacent air flow and for selecting the atomized
or non-atomized method of application.
