A computing device includes a housing with various electrical and/or mechanical
components included therein. Disposed within the housing is a processor assembly
that includes a fan. The fan is configured to draw air into the interior of the
housing and force air heated by the internal components of the computing device
from the interior of the housing. The fan has a diameter that is larger than the
smallest dimension of the three orthogonal dimensions of the housing of the computing
device and generates low levels of acoustic noise having a low frequency. Additionally,
the processor assembly includes a support structure that supports the fan and reduces
the effects of electromagnetic emissions generated by a processor of the processor
assembly upon electrical devices adjacent to the computing device.
