A board for printed wiring comprises an electromagnetic wave absorbing laminate
(EM) provided on a surface of a substrate (1) with the intervention of an
adhesive layer (2) of a metal oxide, the electromagnetic wave absorbing
laminate (EM) comprising: (a) a magnetic layer (3) comprising a plurality
of magnetic particles (31) having an average particle diameter of 1 to 150
nm and isolated from each other by an electrically insulative material (32);
and (b) an electrically insulative layer (4), being alternately stacked
in a multi-layer structure, the board for printed wiring has a reduced thickness
and an improved electromagnetic wave absorbing characteristic in a high frequency
band of not lower than gigahertz, as compared with a conventional one which has
an electromagnetic wave absorbing layer of a composite material including fine
magnetic particles simply dispersed in a resin binder.
