To provide a wafer heating apparatus that can measure a surface temperature of
a wafer accurately and responsively. A front surface of a ceramic plate 2 serves
as a mounting surface on which a wafer is placed, and a rear surface or an inner
portion of the ceramic plate 2 is formed with a resistance heating element
5. A recess 9 is formed in the rear surface of the ceramic plate
2. A temperature measuring member formed of a temperature sensor 8a
and leads 8 is inserted in the recess 9 so as to be held by filling
17. In the wafer heating apparatus, a length along the leads from the front
of the protective tube to a point where the leads are exposed from the filling
is set to 5 to 30 times an outer diameter of the protective tube.
