Temporary, conformable contacts for microelectronic components

   
   

Various aspects of the invention provide temporary interfaces for microelectronic components, microelectronic component test systems, and methods of testing microelectronic components. One of the disclosed temporary interfaces employs a substrate having a plurality of terminals and a switch layer carrying a plurality of actuatable liquid switches. These switches may be adapted to conform to a surface of a component terminal to electrically connect the component terminal to a terminal of the substrate. Another adaptation provides a microelectronic component test system including a microelectronic component including a plurality of terminals. A body is juxtaposed with, but spaced from, the microelectronic component. The body carries a plurality of conduits and a conformable conductor is associated with each conduit. Each of these conformable conductors comprises a volume of electrically conductive liquid and the associated conduit.

 
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