A contact structure for establishing electrical connection with contact targets.
The contact structure is formed of a contactor carrier and a plurality of contactors
attached to a contactor carrier. The contactors are inserted in diagonal through
holes on the contactor carrier and attached to the contactor carrier through adhesives.
The contactor has a top end having a flat top surface, a straight diagonal beam
integral with the top end and configured by an upper beam portion and a lower beam
portion, and a lower end at an end of the lower beam portion to contact with a
contact target. A length of the upper beam portion and a length of the lower beam
portion are about the same. A probe contact assembly using the contact structure
is also disclosed which incorporates a flip chip bonding technology to interconnect
the components therein.
