Epoxy resin compositions are disclosed which comprise (A) at least one silicone
epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride
curing agent, (D) at least one ancillary curing catalyst, and optionally at least
one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or
refractive index modifiers. Also disclosed are packaged solid state devices comprising
a package, a chip (4), and an encapsulant (11) comprising an epoxy
resin composition of the invention. A method of encapsulating a solid state device
is also provided.
