An electronic component module includes: printed-circuit boards on which a shield
layer is formed; a spacer positioned between the printed-circuit boards, the spacer
equipped with a shielding feature which forms as partitions a first cavity and
a second cavity between the printed-circuit boards; a first electronic component
positioned in the first cavity and mounted on any one of the printed-circuit boards
and used in a first frequency band; a second electronic component positioned in
the second cavity and mounted on any one of the printed-circuit boards, the second
electronic component used in a second frequency band; a patch antenna formed on
the surface of the printed-circuit board opposite that on which the spacer is mounted,
the antenna transmitting and receiving radio waves at least one of in the first
and second frequency bands; and terminals formed on the surface of the printed-circuit
board opposite that on which the spacer is mounted.
