The present invention relates to a method for manufacturing a thin film device.
The thin film device is manufactured by bonding a second substrate (106)
to a thin film device layer (103) provided on a protective layer (102)
formed on a first substrate (101) through a first adhesive layer (105),
then, completely or partly removing the first substrate (101) in accordance
with a process including at least one process of a chemical process and a mechanical
polishing process, bonding a third substrate (109) to the exposed protective
layer (102) or the protective layer (102) covered with the partly
removed first substrate (101) through a second adhesive layer (108)
and separating or removing the second substrate (106). Thus, the thin film
device suitable for a light and thin display panel is manufactured without deteriorating
a ruggedness.
