Methods and apparatus are described for capacitively signaling between different
semiconductor chips and modules without the use of connectors, solder bumps, wire-bond
interconnections or the like. Preferably, pairs of half-capacitor plates, one half
located on each chip, module or substrate are used to capacitively couple signals
from one chip, module or substrate to another. The use of plates relaxes the need
for high precision alignment as well as reduces the area needed to effect signaling,
and reduces or eliminates the requirements for exotic metallurgy.
