A method and system for transferring a plurality of integrated circuit dies from
a first surface to a second surface is described. Each hollow barrel of a plurality
of hollow barrels is applied to a respective die residing on the first surface.
The respective die is caused to move into each hollow barrel in parallel. These
steps are repeated until each hollow barrel contains a stack of dies of a predetermined
number. A die from each hollow barrel is deposited onto the second surface until
the stack of dies contained by each hollow barrel is substantially depleted.
