Concepts for conveniently arranging devices for the transduction of signals
to and from voltage and current domains to infrared radiation domains is described.
Specifically, optoelectronic components and methods of making the same are described.
In one aspect, the optoelectronic component includes a base substrate having a
pair of angled (or substantially perpendicular) faces with electrical traces extending
therebetween. A semiconductor chip assembly is mounted on the first face of the
base substrate and a photonic device is mounted on the second face. Both the semiconductor
chip assembly and the photonic device are electrically connected to traces on the
base substrate. The semiconductor chip assembly is generally arranged to be electrically
connected to external devices. The photonic devices are generally arranged to optically
communicate with one or more optical fibers. The described structure may be used
with a wide variety of photonic devices. In some embodiments the base substrate
is formed from a ceramic material having the electrical traces formed thereon.
In other implementations the substrate includes a backing block having a flexible
printed circuit substrate adhered thereto.
