A circuit board assembly with an array of closely spaced circuit components mounted
thereon. The board has a pattern of conductive strips on both front and back faces
and the strips are connected through the board by thermally conductive vias. The
circuit components are mounted on one side of the board and a layer of thermally
conductive, double-sided adhesive tape is laid over the conductive strips on both
faces of the board. Heat sinks are then applied against the tape on both sides
of the board to conduct heat from the board through the tape.
