A laser beam (102) cuts through a component carrier mask (96) made
of thin elastomeric material such as silicone rubber to form slots (98)
having slot openings of a desired shape. In a preferred embodiment, a light absorptivity
enhancement material such as iron oxide introduced into the silicone rubber causes
formation of a flexible support blank that operationally adequately absorbs light
within a light absorption wavelength range. A beam positioner (106) receiving
commands from a programmed controller causes a UV laser beam of a wavelength that
is within the light absorption wavelength range to cut into the mask multiple slots
with repeatable, precise dimensions. Each of the slots cut has opposed side margins
that define between them a slot opening of suitable shape to receive a miniature
component (10) and to exert on it optimal holding and release forces.
