A laminate having improved resistance to separation failure when incorporated
into
a flexible circuit structure. The laminate comprising a highly bondable polyimide
and is preferably formed from a polyamic acid comprising a tetracarboxylic acid
component, a diamine component, and 0.1 to 5.0 mole % of a dicarboxylic acid component,
with respect to the tetracarboxylic acid component, and wherein the adhesive strength
of the laminate is greater than 10 N/cm, and more preferably greater than 19 N/cm.
