The providing of an array interface of conductive joint members for use in forming
interconnections between mating surfaces such as a pad on a surface mount electronic
device and contacts on a circuit card where one portion of the conductive joint
members are of a relatively elongated or oval outline and are oriented with the
longer dimension in one direction to accommodate wiring spacing and another portion
oriented in a different direction for accommodating expansion stress. In manufacturing
when the relatively elongated shape is oriented with the longer dimension along
the wiping motion direction in a screen type forming of the conductive joint members
the slurry of material that is to be the conductive joint members fills the openings
in the screen more reliably and the areas of the conductive members are more uniform.
The invention provides the advantages of an increase in the number of wiring lines,
an increase in uniformity of wiped screen deposition conductive joint member formation,
ability to employ more than one out of chip and wiring levels in expansion mismatch
stress relief, and ability by conductive joint member dimensional alignment to
improve reliability and flexibility.
