A novel adhesive cures quickly at a lower temperature and ensures reliable connection
of objects the adhesive connects with each other. The adhesive includes a metal
chelate, a silane coupling agent and a thermosetting resin. The silane coupling
agent in the adhesive is hydrolyzed at its alkoxy groups to form silanol groups,
which in turn react with the metal chelate to produce cations in the adhesive.
The resulting cations cause the epoxy resin as a thermosetting resin, to undergo
cationic polymerization. The adhesive of the present invention cures at a lower
temperature by taking advantage of the cationic polymerization.
