A light emitting device assembly comprises a light emitting diode (LED) chip,
a
substrate with two terminals, at least one encapsulation layer, and a thermally
conductive adhesive to connect the LED chip and the substrate. The first terminal
of the substrate is comprised of a portion with a width at least as wide as the
LED chip and a vertical cross-sectional area of at least 30% of the total vertical
cross-sectional area of the encapsulated assembly, and a straight element. The
enlarged first terminal portion provides more area for heat dissipation and conduction,
and along with the thermally conductive adhesive and the encapsulation package,
provide enhanced thermal conductivity.
