A concave cup printed circuit board includes a substrate and a cup forming plate.
The substrate has an electrical circuitry and at least one contact pad connected
to the circuitry. The cup forming plate has at least one through-hole and at least
one cup-shaped wall confining the through-hole. The cup forming plate overlies
and is connected to the substrate such that the through-hole is disposed over the
contact pad. The cup forming plate and the substrate are fabricated separately.
The through-hole is formed in the cup forming plate before the cup forming plate
is connected to the substrate.
