A packaged MEMS device containing the micro mirrors has mounted on it at least
two distinct integrated circuit chips, at least one of which contains the low-voltage
digital-to-analog converts and at least one of which contains the high-voltage
amplifiers. The integrated circuit chips may be mounted directly to the MEMS package,
or they may be indirectly mounted thereto, e.g., by being directly mounted to a
multi-chip module which is in turn mounted on the package. Thus, the MEMS package
is employed in a dual role, 1) that of package for the MEMS device and 2) the role
of a backplane in that it contains mounting places and the wires interconnecting
the MEMS device and chips or modules containing the low-voltage digital-to-analog
converters and the high-voltage amplifiers.
