Atomic layer deposited nanolaminates of HfO2/ZrO2 films as gate dielectrics

   
   

A dielectric film containing HfO2/ZrO2 nanolaminates and a method of fabricating such a dielectric film produce a reliable gate dielectric having an equivalent oxide thickness thinner than attainable using SiO2. A gate dielectric is formed by atomic layer deposition of HfO2 using a HfI4 precursor followed by the formation of ZrO2 on the HfO2 layer. The HfO2 layer thickness is controlled by repeating for a number of cycles a sequence including pulsing the HfI4 precursor into a reaction chamber, pulsing a purging gas into the reaction chamber, pulsing a first oxygen containing precursor into the reaction chamber, and pulsing the purging gas until the desired thickness is formed. These gate dielectrics containing HfO2/ZrO2 nanolaminates are thermodynamically stable such that the HfO2/ZrO2 nanolaminates will have minimal reactions with a silicon substrate or other structures during processing.

 
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