The present invention provides an inspection apparatus for an electrode plate-connected
structure for a secondary cell for inspecting each bonding portion of an electrode
plate-connected structure for a secondary cell including a plurality of electrode
plates which are arranged in parallel to one another at prescribed intervals and
are perpendicularly connected to a power collecting plate. The apparatus is characterized
by including: a lighting section for irradiating light to each of the bonded portions
of the plurality of electrode plates and the power collecting plate; a light receiving
section for detecting a projected image of each of the bonded portions based on
the light irradiated to the electrode plate-connected structure by the lighting
section; and an evaluation section for evaluating a bonding state of each of the
bonding portions based on the projected image of each of the bonded portions detected
by the light receiving section.
