Etch-stop resins

Silicone resins comprising 5 to 50 mole % of (PhSiO_3-x)/2(OH)_x) units and 50 to 95 mole % (HSiO_(3-x)/2(OH)_x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.