An RC extraction tool estimates capacitances of conductors residing along parallel
grid lines on each of a set vertically stacked layers of insulating material of
an IC based on data contained in a IC layout file describing positions of structures
forming the IC. The tool initially processes the layout file to generate a separate
database for each layer. Each database includes a separate table for each grid
line on its corresponding layer, and each table includes a separate entry for each
conductor residing along that grid line containing data indicating dimensions and
a position of its corresponding conductor along that grid line. The tool processes
the databases for each layer in ascending order to estimate capacitances between
conductors on that layer and to generate set of data structures mapping the amount
of conductor surface area on that layer to areas of layers above that layer, and
to areas of layers below that layer in which conductors reside. The tool then processes
the data structures to estimate capacitances between conductors on nearby layers.
