A defect inspection method of inspecting a defect of an inspection object having
a chip pattern, the defect inspection method comprising the steps of: inputting
a captured first image of the inspection object; obtaining a second image having
a predetermined size based on one of a chip size and a size of exposure shot from
the inputted first image; determining an averaged luminance of the obtained second
image; and detecting the defect based on the determined averaged luminance and
a predetermined inspection condition.
