The electroplated components of a magnetic head of the present invention are
fabricated utilizing a seed layer that is susceptible to reactive ion etch removal
techniques. A preferred seed layer is comprised of tungsten or titanium. Following
the electroplating of the components utilizing a fluorine species reactive ion
etch process the seed layer is removed, and significantly, the fluorine RIE process
creates a gaseous tungsten or titanium fluoride compound removal product. The problem
of seed layer redeposition along the sides of the electroplated components is overcome
because the gaseous fluoride compound is not redeposited. The present invention
also includes an enhanced two part seed layer, where the lower part is tungsten,
titanium or tantalum and the upper part is composed of the material that constitutes
the component to be electroplated.
