Material of electronics component and electronics components using the same
material are provided. The material includes repellent that can withstand severe
solder-mounting conditions, and the electronics components such as printed wiring
boards can lasts repelling effect for a long period. The material is used in electronics
components requiring a soldering process, and includes at least curable resin,
filler and the repellent. The repellent has vapor pressure of less than 10,000
nPa at room temperature. Film is formed using the material at a given place of
an electronics component such as a printed wiring board.
