A method for testing an optical chip, while the optical chip is still on a wafer,
utilizing an optical probe, includes the steps of creating an access point on the
wafer adjacent the optical chip. The optical chip having a waveguide having an
axis. A portion of the waveguide is removed to form the access point such that
light exiting the planar optical waveguide is directed in a direction substantially
different from the axis of the waveguide. An optical probe is placed along a propagation
path of the exiting light to optically couple the optical probe and optical chip.
