The light-emitting device includes a light-emitting element chip; a package having
a first recessed portion thereon, in which the light-emitting chip is disposed;
a transparent flexible member covering at least the recessed portion; and a transparent
rigid member disposed on or above the transparent flexible member. The package
has at least a first front surface extending at least outwardly above the first
recessed portion; a second front surface extending outwardly above the first front
surface; and a third surface as the outside of the package extending outwardly
above the second front surface. The rigid member is disposed in the outline of
the second front surface with at least three points of contact. The flexible member
is continuously provided along the first front surface, the second front surface
and the back surface of the rigid member. This light-emitting device is capable
of improved reliability without deteriorating its optical characteristics.
