Resin compositions, processes for preparing the resin compositions and processes for forming resin films

   
   

Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below: ##STR1##

wherein chemical structure A2 includes an alicyclic compound but not an aromatic compound such as a benzene ring so that they provide excellent light transmission over a wide wavelength range. The polyimide precursors are imidized at 7.5% or more and 36% or less so that they are less soluble in developing solutions and therefore are not dissolved in the developing solutions at unexposed parts. Thus, the resin compositions of the present invention can be used to form a resin film having a precise pattern by exposure and development.

 
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