The present invention is directed to a semi-conductor handling equipment cleaning
apparatus configured for use with wafer carriers. The base of the cleaning apparatus
is configured to support the wafer carrier in sealing contact about a first aperture.
A first fluidic circuit is provided for introducing a first cleaning fluid to the
inner surface of the carrier. A second fluidic circuit is provided for introducing
a second cleaning fluid to the outer surface of the carrier. The carrier forms
a barrier with the base so that the cleaning media is isolated so as to substantially
prevent the second fluid used to clean the exterior from communicating with the
first fluid used to clean the interior of the carrier.
