One aspect of this disclosure relates to a method of building a superconductor
device on a substrate, comprising depositing an imprint layer on at least a portion
of the substrate. The imprint layer is imprinted to provide an imprinted portion
of the imprint layer and a non-imprinted portion of the imprint layer. A superconductor
layer is deposited on at least a portion of the imprinted portion of the imprint layer.