A memory card is disclosed which not only suppresses a lowering of the manufacturing
yield caused by warping of a semiconductor chip sealing member, but also reduces
the manufacturing cost by using a less expensive material. The memory card comprises
a thin plate-like cap formed of a synthetic resin and a sealing member mounted
inside the cap. Inside the sealing member are sealed a metallic lead frame and
three semiconductor chips (two memory chips and one control chip) mounted on part
(leads) of the lead frame. The semiconductor chips are electrically connected to
leads through Au wires. Connecting terminals integral with the lead frame are exposed
to the back side of the sealing member.
