In a small semiconductor device having external terminals on a semiconductor
element
and a semiconductor module mounted with the small semiconductor device, disconnection
of the external terminals is prevented when a temperature change occurs under the
conditions that the semiconductor device is mounted on a printed circuit board.
To achieve this a projection is formed on a land which is an external terminal
bonding area of the semiconductor device, and a protruded portion of the projection
is bonded to the external terminal. An intervening portion of a protective film
made of resin material is formed between the lands and semiconductor element.
