A tape assembly for use in wafer dicing includes a layer of adhesive dicing tape having a size at least as large as a footprint of a die, and a screening portion which is adhered to the tape. The screening portion is interposed between the layer of tape and the die when the die is adhered to the layer of tape. The screening portion covers an interior portion of the layer of tape. The screening portion is sized and shaped to leave a sufficient portion of the layer of tape underlying a perimeter of the die exposed to adhere the die to the layer of tape.