A heat-dispersing module of an electronic device is disclosed. The heat-dispersing
module includes: a housing having a top surface, a bottom surface, a first side
surface and a second side surface, wherein the first side surface is opposite to
the second side surface; a heat-dispersing fan mounted on the first side surface
of the housing; a first vent area disposed on the second side surface of the housing;
a second vent area disposed on the top surface of the housing; and a printed circuit
board positioned in the housing, thereby a first airflow channel is formed between
the top surface of the housing and the printed circuit board and a second airflow
channel is formed between the bottom surface of the housing and the printed circuit
board, wherein the printed circuit board produces a relatively higher heat at the
second airflow channel than the first airflow channel and a distance of the second
airflow channel from the printed circuit board to the bottom surface is relatively
larger than that of the first airflow channel from the printed circuit board to
the top surface.