Polyoxymethylene resin composition comprising 40 to 99.5 parts by weight of polyoxymethylene resin (A), and 0.5 to 60 parts by weight of resin consisting of a polyamide elastomer (B) and an acid-modified olefinic resin (C) having an acid modification rate of 0.05 to 15 wt. %, a ratio of (B)/(c) being in a range of 10/90 to 90/10 % by weight, has a much distinguished impact resistance and a good antistatic property, while maintaining the heat stability inherent to the polyoxymethylene resin, as compared with the conventional one, and is suitable for use in OA appliances, VTR appliances, music-image-information appliances, communication appliances, automobile interior and exterior furnishings and industrial sundries.