Polyoxymethylene resin composition comprising 40 to 99.5 parts by
weight of polyoxymethylene resin (A), and 0.5 to 60 parts by weight of resin consisting
of a polyamide elastomer (B) and an acid-modified olefinic resin (C) having an
acid modification rate of 0.05 to 15 wt. %, a ratio of (B)/(c) being in a range
of 10/90 to 90/10 % by weight, has a much distinguished impact resistance and a
good antistatic property, while maintaining the heat stability inherent to the
polyoxymethylene resin, as compared with the conventional one, and is suitable
for use in OA appliances, VTR appliances, music-image-information appliances, communication
appliances, automobile interior and exterior furnishings and industrial sundries.