A thin film magnetic head is provided that includes bumps capable of securing high conductivity. The thin film magnetic head includes a coil layer for inducing a recording magnetic field between lower and upper core layers, a lead conductor layer for supplying a current to the coil layer, a conductive protective layer deposited on the lead conductor layer, a conductive bump formed on the conductive protective layer, and an insulating protective layer formed around the conductive protective layer and the conductive bump. The insulating protective layer includes a first insulating protective sub-layer formed around the conductive protective layer, the surface thereof being coplanar with the surface of the conductive protective layer, and a second insulating protective sub-layer formed separately from the first insulating protective sub-layer after the conductive bump is formed.